PLENSET
Feature
Low-temperature curing type
PLENSET has achieved low curing temparature at 60℃.
which, is unequaled as a curing temparature of a one component type epoxy resin adhesive.
It is therefore applicable to heat sensitive component bonding and plastic bonding.
Features
- Cures at the low temperature of 60degC in the short time of 30 minutes unequaled by other one-component epoxy resins
- Can bond plastics, optical components including lenses, and other heat-sensitive components
- Warps very little during curing because it has a low curing shrinkage ratio and a low coefficient of thermal expansion, and therefore is very effective in bonding precision components together
- Different types vary in viscosity, allowing a choice appropriate to any of a variety of dispense conditions
- Rapidly cures by heating at medium to high temperatures, therefore ensuring in-line curing
Uses
- Assembly of CCD modules for mobile phones
- Forming a bond with the periphery of an optical lens
- Bonding with engineering plastics
| ITEM | AE-901B | AE-901H | AE-901S | AE-901T-DA | Conditions | ||
|---|---|---|---|---|---|---|---|
| Properties before curing |
Appearance | Black viscous liquid |
Black viscous liquid |
Black viscous liquid |
Black viscous liquid |
Visual observation | |
| Viscosity | 60Pa･s | 40Pa･s | 30Pa･s | 17Pa･s | E-type viscometer, 25degC, 20rpm |
||
| Thixotropic index | 1.1 | 2.0 | 1.4 | 2.0 | E-type viscometer, 25degC, 2rpm/20rpm |
||
| Specific gravity | 1.5 | 1.5 | 1.5 | 1.4 | 25degC | ||
| Gel time | 120sec. at 80degC |
105sec. at 80degC |
100sec. at 80degC |
100sec. at 80degC |
Hot plate | ||
| Recommended cure schedule | 30min. at 60degC |
30min. at 60degC |
30min. at 60degC |
30min. at 60degC |
Convection oven heating |
||
| Properties
after |
Lap shear strength | 16N/mm2 | 15N/mm2 | 16N/mm2 | 17N/mm2 | mild Steel plate | |
| 2.7N/mm2 | 3.9N/mm2 | 3.8N/mm2 | 3.4N/mm2 | polycarbonate | |||
| Cure shrinkage | 2.8% | 2.2% | 2.5% | 1.9% | Calculated from sp.gr. before & after cure |
||
| Glass transition temperature |
55degC | 50degC | 50degC | 44degC | TMA | ||
| Coefficient of Thermal Expansion |
α1 | 50ppm | 45ppm | 50ppm | 60ppm | ||
| α2 | 80ppm | 115ppm | 120ppm | 150ppm | |||
| Flexural modulus | 5.7GPa | 4.4GPa | 4.5GPa | 3.3GPa | DMS, 25C | ||
| Water absorption | 0.7% | 0.9% | 1.0% | 1.3% | 1h boiling | ||
Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.
