PLENSET

Feature

Low-temperature curing type

PLENSET has achieved low curing temparature at 60℃.

which, is unequaled as a curing temparature of a one component type epoxy resin adhesive.

It is therefore applicable to heat sensitive component bonding and plastic bonding.

Features

  • Cures at the low temperature of 60degC in the short time of 30 minutes unequaled by other one-component epoxy resins
  • Can bond plastics, optical components including lenses, and other heat-sensitive components
  • Warps very little during curing because it has a low curing shrinkage ratio and a low coefficient of thermal expansion, and therefore is very effective in bonding precision components together
  • Different types vary in viscosity, allowing a choice appropriate to any of a variety of dispense conditions
  • Rapidly cures by heating at medium to high temperatures, therefore ensuring in-line curing

Uses

  • Assembly of CCD modules for mobile phones
  • Forming a bond with the periphery of an optical lens
  • Bonding with engineering plastics
AE-901 series Application Example
ITEM AE-901B AE-901H AE-901S AE-901T-DA Conditions
Properties
before
curing
Appearance Black
viscous liquid
Black
viscous liquid
Black
viscous liquid
Black
viscous liquid
Visual observation
Viscosity 60Pa・s 40Pa・s 30Pa・s 17Pa・s E-type viscometer,
25degC, 20rpm
Thixotropic index 1.1 2.0 1.4 2.0 E-type viscometer,
25degC, 2rpm/20rpm
Specific gravity 1.5 1.5 1.5 1.4 25degC
Gel time 120sec.
at 80degC
105sec.
at 80degC
100sec.
at 80degC
100sec.
at 80degC
Hot plate
Recommended cure schedule 30min.
at 60degC
30min.
at 60degC
30min.
at 60degC
30min.
at 60degC
Convection oven
heating
Properties

after
curing

Lap shear strength 16N/mm2 15N/mm2 16N/mm2 17N/mm2 mild Steel plate
2.7N/mm2 3.9N/mm2 3.8N/mm2 3.4N/mm2 polycarbonate
Cure shrinkage 2.8% 2.2% 2.5% 1.9% Calculated from sp.gr.
before & after cure
Glass transition
temperature
55degC 50degC 50degC 44degC TMA
Coefficient of
Thermal
Expansion
α1 50ppm 45ppm 50ppm 60ppm
α2 80ppm 115ppm 120ppm 150ppm
Flexural modulus 5.7GPa 4.4GPa 4.5GPa 3.3GPa DMS, 25C
Water absorption 0.7% 0.9% 1.0% 1.3% 1h boiling

Technical data presented in this document are typical experimental values and do not signify any of the products’ specifications. The data may be revised without prior notice.

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