“PLENSET” is a series of one-component epoxy resin adhesives based on latent curing agent technologies.
It has the following outstanding features made possible by our unique curing system.
It plays active roles in various fields, such as precision electronic components including camera modules, semiconductor packaging, and car electronics.
“PLENSET” has achieved curing at 60degC, which is unequaled as a curing temperature of a one-component type epoxy resin adhesive.
It is therefore applicable to heat-sensitive component bonding or plastic bonding.
Among one-component adhesives, “PLENSET” has the highest level of curing speed, thereby contributing to an increase in operation efficiency.